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This paper focuses on memory bandwidth and advanced packaging as critical bottlenecks in the AI compute stack. It argues that GPU performance alone does not determine AI system capability; memory, interconnect density, thermal performance, substrate technology, yield, and packaging capacity increasingly shape what can be built. The paper highlights HBM, advanced packaging, and integration as essential constraint layers beneath AI scaling.
This paper focuses on memory bandwidth and advanced packaging as critical bottlenecks in the AI compute stack. It argues that GPU performance alone does not determine AI system capability; memory, interconnect density, thermal performance, substrate technology, yield, and packaging capacity increasingly shape what can be built. The paper highlights HBM, advanced packaging, and integration as essential constraint layers beneath AI scaling.